首页> 外文会议>Symposium on GaN and related alloys >Processing and device performance of GaN power rectifiers
【24h】

Processing and device performance of GaN power rectifiers

机译:GaN电源整流器的处理和设备性能

获取原文

摘要

Mesa and planar geometry GaN Schottky rectifiers were fabricated on 3-12μm thick epitaxial layers. In planar diodes utilizing resistive GaN, a reverse breakdown voltage of 3.1 kV was achieved in structures containing p-guard rings and employing extension of the Schottky contact edge over an oxide layer. In devices without edge termination, the reverse breakdown voltage was 2.3 kV. Mesa diodes fabricated on conducting CaN had breakdown voltages in the range 200-400 V, with on-state resistances as low asΩ·cm{sub}(-2).
机译:MESA和平面几何GaN肖特基整流器在3-12μm厚的外延层上制造。在利用电阻GaN的平面二极管中,在含有P罩环的结构中实现了3.1kV的反向击穿电压,并在氧化物层上采用肖特基接触边缘的延伸。在没有边缘终止的设备中,反向击穿电压为2.3 kV。在导电上制造的MESA二极管可以在200-400V范围内具有击穿电压,具有低至Ω·cm {sub}( - 2)的导通电阻。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号