Crosstalk Associated with Solder Ball and/or Cutout-Hole on the Power/Ground Planes/Nets

机译：与电源/地面/网上的焊球和/或切口孔相关联的串扰

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This paper presents crosstalk mechanisms due to sold balls and/or holes arranged in the power/ground plane. This paper explains how to identify coupling mechanisms and how to control the crosstalk within manageable strength.

机译：本文提出了串扰机制，因为出售在电源/地面中布置的球和/或孔。本文介绍了如何识别耦合机制以及如何控制可管理强度的串扰。

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来源
《IEEE International Symposium on Electromagnetic Compatibility》|2016年|937p|共5页
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作者
Daniel Wu; Geoff Zhang; Yohan Frans; Chris Borrelli; Sarajuddin Niazi; Hong Shi; Ken Chang;
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原文格式 PDF
正文语种
中图分类 TM15-53;
关键词
power/ground nets; SerDes; Gigabit transceiver; crosstalk; slot; hole;

机译：电源/地面网;塞峰;千兆收发器;串扰;插槽;洞;

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专利

1. Electromagnetic radiation from the narrow space between the power plane and ground plane [J] . Ken-ichi Ito 電子情報通信学会技術研究報告. 環境電磁工学. Electromagnetic Compatibility . 2001,第178期

机译：来自电源层和接地层之间狭窄空间的电磁辐射
2. Electromagnetic radiation from the narrow space between the power plane and ground plane [J] . Ken-ichi Ito 電子情報通信学会技術研究報告. 環境電磁工学. Electromagnetic Compatibility . 2001,第178期

机译：电源平面与地面之间的窄空间的电磁辐射
3. Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling [J] . Youngwoo Kim, Jonghyun Cho, Kyungjun Cho, Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2017,第9期

机译：接地平面偏移的玻璃中介层电磁带隙结构，用于宽带抑制功率/地面噪声耦合
4. Crosstalk Associated with Solder Ball and/or Cutout-Hole on the Power/Ground Planes/Nets [C] . Daniel Wu, Geoff Zhang, Yohan Frans, IEEE International Symposium on Electromagnetic Compatibility . 2016

机译：与电源/地面/网上的焊球和/或切口孔相关联的串扰
5. Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic lead-tin and lead-free solders. [D] . Huang, Xingjia. 2003

机译：用共晶铅锡和无铅焊料对塑料球栅阵列，芯片规模和倒装芯片封装的焊球剪切强度进行调查和分析。
6. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography [O] . Xiuyun Zhou, Jinlong Zhou, Guiyun Tian, 2015

机译：基于涡流脉冲热成像技术的锡球缺陷检测研究
7. A Novel Meander Split Power/Ground Plane Reducing Crosstalk of Traces Crossing Over [O] . Jung-Han Lee 2019

机译：一种新型曲折分裂功率/地面平面减少痕迹交叉的痕迹

Crosstalk Associated with Solder Ball and/or Cutout-Hole on the Power/Ground Planes/Nets

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