3D Accelerated Electromagnetic Integral Equation Solvers on Parallel Processors for Microelectronic Simulation

摘要

Simulation of distributed effects in modern day microelectronic circuits is gaining in importance owing to rapid increase in packing density, clock speed and stringent accuracy criteria. Boundary element-based field solution is becoming one of the chosen trends in these simulation tasks owing to its efficiency. Simulation of complex microelectronic circuits can be further accelerated using compressed matrix representation and fast matrix vector products for an accelerated iterative solution. For solving even larger problems in acceptable time and limited local memory resources the fast solution algorithm can be carried out on distributed memory clusters as shown here. This paper deals with the description of the basic algorithms, load balancing techniques and other important aspects of distributed memory -accelerated field solver.