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Application of Microstencil Lithography on Polymer Surfaces for Microfluidic Systems with Integrated Microelectrodes

机译:微模板光刻技术在集成微电极的微流控系统聚合物表面上的应用

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Microstencil lithography, a resistless, single-step direct vacuum patterning method, is one of promising methods for metal micropattern definition on polymer substrates that are not suitable for conventional photolithography. We propose to apply microstencil lithography to fabricate microelectrodes on flat and pre-structured polymer substrates which form parts of microfluidic systems with incorporated microelectrodes. However, microstencil lithography is accompanied by two main issues when considered as a low-cost, reproducible alternative to standard photolithography on polymer substrates: clogging and blurring. The clogging of stencil apertures induced by metal evaporation was checked in detail, and it was determined that approximately 50 % of the thickness of the evaporated metals was deposited at the side walls of the stencil apertures. The influence of gap presence on the deposited structures was also analyzed experimentally, and we quantified the pattern blurring
机译:微模板光刻技术是一种无抗蚀剂的单步直接真空图案化方法,是一种在不适合常规光刻技术的聚合物基材上进行金属微图案定义的有前途的方法之一。我们建议应用微模板光刻技术在平坦和预结构化的聚合物基底上制造微电极,该基底形成结合了微电极的微流体系统的一部分。然而,当被认为是在聚合物基材上进行标准光刻的一种低成本,可重现的替代方法时,微模板光刻伴随着两个主要问题:堵塞和模糊。详细检查了由金属蒸发引起的模板孔的堵塞,并确定了蒸发金属厚度的大约50%沉积在模板孔的侧壁上。间隙存在对沉积结构的影响也进行了实验分析,我们量化了图案模糊

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