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Simple design formula for parallel plate mode suppression by ground via-holes

机译:通过接地通孔抑制平行板模式的简单设计公式

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In a multi-layered RF circuit, it is important to avoid unexpected coupling caused by a parallel plate mode excited between different ground layers. Ground via-holes that short-circuit different ground layers are used for suppressing this mode. Quantitative evaluation of relations between suppression effect and ground via-hole disposition is required for optimal design. In this paper, a simple design formula that describes the suppression ratio is derived by mode-matching technique. The results of comparison with an FEM simulation validate our proposing formula. It is shown that the technique is indispensable for designing optimal disposition of via-holes to minimize the area of the ground via-holes for desired performance.
机译:在多层RF电路中,重要的是要避免由不同接地层之间激发的平行平板模式引起的意外耦合。短路不同接地层的接地通孔可用于抑制此模式。为了进行最佳设计,需要对抑制效果和接地通孔位置之间的关系进行定量评估。本文采用模式匹配技术推导了一个简单的描述抑制比的设计公式。与有限元模拟的比较结果验证了我们提出的公式。已经表明,该技术对于设计通孔的最佳布置以最小化接地通孔的面积以获得期望的性能是必不可少的。

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