Reliability testing and data analysis of an 1657CCGA (ceramic column grid array) package with lead-free solder paste on lead-free PCBs (printed circuit boards)

摘要

In this study, the thermal cycling test of the 1657CCGA package with 95.5wt%Sn3.9wt%Ag0.6wt%Cu and 63wt%Sn37wt%Pb solder pastes on lead-free PCBs with HASL (hot-air solder leveling) CuSn, NiAu (electroless Ni and immersion Au, ENIG), and Entek OSP (organic solderability preservative) surface finishes are performed. The test stopped at 7500 cycles (0 to 100/spl deg/C, 40-minute cycle). The test data is best fitted to the Weibull life distribution. Also, the sample mean, population mean, sample characteristic life, true characteristic life, sample Weibull slope, and true Weibull slope for the 1657CCGA package on the lead-free PCBs are provided and discussed. Furthermore, the relationship between the reliability and the confidence intervals for the life distribution is established. Finally, the confidence level for comparing the quality (mean life) of the CCGA solder joints is determined.