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Silicon substrate coupling noise modeling, analysis, and experimental verification for mixed signal integrated circuit design

机译:硅基板耦合噪声建模,分析和混合信号集成电路设计的实验验证

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摘要

The frequency-variant characteristics of a silicon substrate were physically modeled, analytically investigated, and experimentally verified. The scalable circuit model parameter extraction methodology was newly developed. Thus, the proposed technique can provides the efficient performance evaluations as well as the accurate design guidelines concerned with the complicated mixed signal integrated circuit designs.
机译:硅衬底的频率变型特性在物理上进行了建模,分析研究和实验验证。可扩展电路模型参数提取方法是新开发的。因此,所提出的技术可以提供有效的性能评估以及与复杂的混合信号集成电路设计相关的准确设计指南。

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