Integration of passive components in thin film multilayer MCM-D technology for wireless front-end applications

摘要

In the current trend towards portable applications, the integration of passive components has become very important. This paper introduces high quality integrated passive components in thin film multilayer MCM-D technology. The main characteristics and modeling issues for use at RF and microwave frequencies are discussed. Also, a number of circuits applicable in wireless front-ends using the integrated passives are presented. These show that MCM-D may be used for the integration of miniature systems for wireless applications.