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A Highly Integrated X-band Frequency Quadrupler MMIC using 3D-MMIC Technology

机译:采用3D-MMIC技术的高度集成X波段四倍频MMIC

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A highly integrated X-band frequency quadrupler MMIC using three-dimensional MMIC (3D-MMIC) technology is presented. It consists of four amplifiers, two doublers, and a 2-band elimination filter. These seven circuits are integrated on only a 2.25 mm times 1.05 mm chip. The third and fifth harmonic components, which are spurious components nearest to the desired component, are well suppressed. The desired/undesired ratio is about 40 dB. The MMIC supplies +5 dBm of the fourth harmonic component at input power as low as -10 dBm. The power dissipation of the MMIC is only 160 mW.
机译:提出了使用三维MMIC(3D-MMIC)技术的高度集成的X波段四倍频MMIC。它由四个放大器,两个倍增器和一个2频带消除滤波器组成。这七个电路仅集成在一块2.25毫米乘以1.05毫米的芯片上。作为最接近期望分量的寄生分量的三次谐波分量和三次谐波分量得到了很好的抑制。期望/不期望的比率是大约40dB。 MMIC在低至-10 dBm的输入功率下提供+5 dBm的四次谐波分量。 MMIC的功耗仅为160 mW。

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