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Hydrogen Release and Defect Formation During Heat Treatments of SiNx:H/a-Si: H Double Passivation Layer on C-SI Substrate

机译:C-SI衬底上SiNx:H / a-Si:H双钝化层热处理过程中的氢释放和缺陷形成

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摘要

The quality and temperature stability of surface passivation of silicon by a double layer consisting of a hydrogenated amorphous silicon thin film capped by a silicon nitride anti-reflection coating are studied. It is established that the passivation effect of the double layer can be significantly enhanced after short annealing for temperatures up to about 500degC, whereas annealing at higher temperatures results in degradation of the passivation properties. It is found that the increased effective recombination lifetime after annealing at temperatures below 500degC results from hydrogen redistribution in the interface region. Furthermore, presence of interfacial structural defects formed due to hydrogen release at temperatures around 600degC, is believed to be the cause of the lifetime decrease after heat treatments at higher temperatures
机译:研究了由氮化硅减反射涂层覆盖的氢化非晶硅薄膜组成的双层对硅进行表面钝化的质量和温度稳定性。已经确定,在短短退火至约500℃的温度后,双层的钝化效果可以显着增强,而在较高温度下的退火导致钝化性能下降。发现在低于500℃的温度下退火之后,增加的有效重组寿命是由于界面区域中氢的重新分布所致。而且,据信由于在约600℃的温度下释放氢而形成的界面结构缺陷的存在是在高温下进行热处理后寿命降低的原因。

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