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A non-destructive method of testing for radiation hardness of integrated circuits

机译:集成电路辐射硬度的非破坏性测试方法

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There has existed a long-standing need to design integrated circuits that withstand the effects of ionizing radiation as part of the effort to obtain radiation hardened electronic systems. The results of design efforts require testing to verify the degree of radiation hardness achieved. But testing that involves the application of ionizing radiation directly is destructive and can only be applied during product development. In this paper, we have proposed a non-destructive method of testing for radiation hardness of integrated circuits using high magnetic fields. Experimental data is included to show the correlation between the effects of ionizing radiation and high magnetic fields on the current-voltage characteristics of transistors and the input-output voltage transfer characteristics of logic gates. A preliminary estimate is made that 8 T of magnetic fields can produce the same effect as 1 Megarad (Si) of total ionizing radiation dose for testing purposes.
机译:作为获得辐射硬化电子系统的努力的一部分,长期以来需要设计承受电离辐射效应的集成电路。设计工作的结果需要进行测试,以验证所达到的辐射硬度。但是直接涉及电离辐射应用的测试具有破坏性,只能在产品开发过程中应用。在本文中,我们提出了一种使用高磁场测试集成电路辐射硬度的非破坏性方法。包括实验数据以显示电离辐射和高磁场对晶体管的电流-电压特性与逻辑门的输入-输出电压传输特性之间的关系。初步估计,出于测试目的,磁场8 T可以产生与总电离辐射剂量1兆拉德(Si)相同的效果。

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