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Effect of bulk carrier generation-recombination centers upon the I-V characteristic of silicon PN junctions

机译:载流子产生-重组中心对硅PN结的I-V特性的影响

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Further experiments regarding the leakage current of mesa silicon PN junctions are presented. For gold diffused junctions, generation-recombination centers lead to a dominance of the bulk leakage current component both at reverse and low forward bias voltage but a minor surface component still controls the junction blocking capability. For electron irradiated junctions, the surface component of reverse current may be the primary component up to a junction temperature of 100-150/spl deg/C. When the density of bulk generation-recombination centers is low, their influence on the reverse I-V characteristic is negligible from the room temperature up to above 200/spl deg/C.
机译:提出了有关台面硅PN结泄漏电流的进一步实验。对于金扩散结,无论是在反向还是在低正向偏置电压下,生成复合中心都会导致整体漏电流分量占主导地位,但较小的表面分量仍会控制结的阻断能力。对于电子辐照结,反向电流的表面成分可能是直到结温为100-150 / spl deg / C的主要成分。当大量生成-重组中心的密度低时,从室温到200 / spl deg / C以上,它们对反向I-V特性的影响都可以忽略不计。

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