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Simulation and evaluation of ground bounce induced crosstalk in a mixed logic ball grid array substrate design

机译：混合逻辑球栅阵列基板设计中地面反弹引起的串扰的仿真和评估

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A concurrent engineering path between package design and electrical simulation software tools was utilized to rapidly evaluate digital ground bounce and resulting crosstalk on nearby analog conductors for a mixed logic ball grid array (BGA) substrate design. Generated boundary element and lumped equivalent circuit models are discussed along with signal integrity analysis results.

机译：利用封装设计和电气仿真软件工具之间的并行工程路径，可以快速评估数字地面弹跳以及在附近的模拟导体上产生的串扰，以进行混合逻辑球栅阵列（BGA）基板设计。讨论了生成的边界元素和集总等效电路模型以及信号完整性分析结果。

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《》|1998年|P.105-108|共4页
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Zahn; B.A.;
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中图分类无线电电子学、电信技术;
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1. A Fast Macro-Model for Substrate Coupling and Ground Bounce Induced Substrate Noise Simulation in Mixed Signal VLSI [J] . S. M. REZAUL HASAN, OMID SHOAEI Analog Integrated Circuits and Signal Processing . 2003,第3期

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2. Analysis of ground-bounce induced substrate noise coupling in a lowresistive bulk epitaxial process: design strategies to minimize noiseeffects on a mixed-signal chip [J] . Felder M., Ganger J. IEEE Transactions on Circuits and Systems. II, Express Briefs . 1999,第11期

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3. Analysis of ground-bounce induced substrate noise coupling in a low resistive bulk epitaxial process: design strategies to minimize noise effects on a mixed-signal chip [J] . Felder M., Ganger J. IEEE Transactions on Circuits and Systems. II . 1999,第11期

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4. Simulation and evaluation of ground bounce induced crosstalk in a mixed logic ball grid array substrate design [C] . Zahn B.A., Institute of Electric and Electronic Engineer IEEE Topical Meeting on Electrical Performance of Electronic Packaging . 1998

机译：混合逻辑球栅极阵列基板设计中地面反弹诱导串扰的仿真与评价
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Simulation and evaluation of ground bounce induced crosstalk in a mixed logic ball grid array substrate design

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