Rapid thermal modeling for smart-power and integrated multichip power circuit design

摘要

This paper recalls how the two-port network theory can be introduced to solve the 3D heat flow equation in a multilayered plane structure. In this paper we present two pieces of software based on the application of this theory, which are used to analyze the thermal behavior of SmartMos circuits with a fairly good accuracy and short computational times. Finally, an illustration is given and some comparisons are made with experiments and an FE code.