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Two orders of magnitude leakage power reduction of low voltage SRAMs by row-by-row dynamic V/sub dd/ control (RRDV) scheme

机译:通过逐行动态V / sub dd /控制(RRDV)方案将低压SRAM的泄漏功率降低了两个数量级

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A novel SRAM scheme is proposed that can reduce the active leakage power by two orders of magnitude. In the low voltage region of less than 1 V, the VTH, V/sub TH/, is lowered to less than 0.2 V and the leakage power of memory cells becomes a dominant issue. By dynamically dropping the supply voltage of un-accessed cells row by row, the cell leakage can be reduced exponentially through the drain induced barrier lowering (DIBL) effect. Additionally, to lower the leakage from bit-line through transfer gates of memory cells, un-accessed word lines are applied with a negative voltage together with a reduced swing write technique. The basic advantage is verified by measurement and the effectiveness in future generations is discussed by simulations.
机译:提出了一种新颖的SRAM方案,该方案可以将有功泄漏功率降低两个数量级。在小于1V的低压区域中,VTH,V / sub TH /,降低到小于0.2V,并且存储单元的泄漏功率成为主要问题。通过逐行动态降低未访问单元的电源电压,可以通过漏极诱导势垒降低(DIBL)效应以指数方式减少单元泄漏。另外,为了降低从位线通过存储单元的传输门的泄漏,对未访问的字线施加负电压,同时减少摆幅写入技术。通过测量验证了基本优势,并通过仿真讨论了后代的有效性。

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