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Measurement of thermo-mechanical deformations of wafer-level CSP assembly under thermal cycling condition

机译：热循环条件下晶片级CSP组件热机械变形的测量

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来源
《》|2001年|P.323-327|共5页
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作者
Suk-Jin Ham; Soon-Bok Lee;
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中图分类无线电电子学、电信技术;
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入库时间 2022-08-26 14:39:36

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2. Thermal Deformation Measurement and Stress Analysis of PQFP Assembly during Power Cycling [J] . 戴福隆, 石玲, 温秀梅清华大学学报：自然科学英文版 . 1998,第002期

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3. Life assessment of a low-alloy martensitic steel under isothermal low-cycle fatigue-creep and thermo-mechanical fatigue-creep loading conditions [J] . Michal Bartosak, Jakub Horvath, Zdenek Pitrmuc, International Journal of Fatigue . 2021,第Apra期

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4. Measurement of thermo-mechanical deformations of wafer-level CSP assembly under thermal cycling condition [C] . Suk-Jin Ham, Soon-Bok Lee International Symposium on Electronic Materials and Packaging . 2001

机译：热循环条件下晶片级CSP组装热机械变形的测量
5. Fluid mechanics and heat transfer measurements within a porous regenerator under oscillatory flow conditions: Stirling cycle thermal regeneration. [D] . Niu, Yi. 2005

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6. A Force-Sensor-Based Method to Eliminate Deformation of Large Crankshafts during Measurements of Their Geometric Condition [O] . Krzysztof Nozdrzykowski, Leszek Chybowski 2019

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7. Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies [O] . Ghaffarian, Reza 2000

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8. Effect of thermal cycling ramp rate on CSP assembly reliability [R] . Ghaffarian, R. 2001

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Measurement of thermo-mechanical deformations of wafer-level CSP assembly under thermal cycling condition

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