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Automotive Printed Wiring Board Manufacturers Succeed With 100 Solids Con Formal Coatings And No-clean Flux

机译：汽车印刷线路板制造商成功获得100％固体保形涂料和免清洗助焊剂

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来源
《》|2001年|P.58-61|共4页
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作者
Wilson; S.; Fogelsinger-Huss; M.;
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中图分类无线电电子学、电信技术;
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1. Reliability of Printed Circuit Boards Processed Using No-Clean Flux Technology in Temperature–Humidity–Bias Conditions [J] . Zhan S., Azarian M. H., Pecht M. IEEE transactions on device and materials reliability . 2008,第2期

机译：在温度-湿度-偏置条件下使用免清洗助焊剂技术处理的印刷电路板的可靠性
2. Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux [J] . Zhan S., Azarian M.H., Pecht M.G. IEEE transactions on electronics packaging manufacturing . 2006,第期

机译：使用免清洗助焊剂的保形涂层印刷电路板的表面绝缘电阻
3. Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections [J] . T.T. Mattila, V. Vuorinen, J.K. Kivilahti Journal of Materials Research . 2004,第11期

机译：印刷线路板涂料对无铅芯片级封装互连可靠性的影响
4. Automotive Printed Wiring Board Manufacturers Succeed With 100 Solids Con Formal Coatings And No-clean Flux [C] . Wilson S., Fogelsinger-Huss M., Institute of Electric and Electronic Engineer Japan International Electronic Manufacturing Technology Symposium . 2001

机译：汽车印刷配线板制造商成功搭配100％固体涂层和无清洁的通量
5. Recycling of electronic waste: Printed wiring boards. [D] . Luyima, Alex. 2013

机译：电子废物的回收：印刷线路板。
6. Special Articles: MCM Using Multi Layer Printed Wiring Boards, Organic Thin Film Multi Layer Printed Wiring Boards. Multi-Chip Module: The Status Quo and Trend in Development. [O] . Tatsuo HONDA 1993

机译：特殊文章：MCM采用多层印刷线路板，有机薄膜多层印刷线板。多芯片模块：现状与开发趋势。
7. Alternative Technologies for Making Holes Conductive: Cleaner Technologies for Printed Wiring Board Manufacturers. [R] . 2001

机译：制作导电孔的替代技术：印刷线路板制造商的清洁技术。

Automotive Printed Wiring Board Manufacturers Succeed With 100 Solids Con Formal Coatings And No-clean Flux

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