Arrays of sharp, conical microstructures were obtained by structuring the surface of a silicon wafer using femtosecond laser-assisted etching. Analysis of the arrays shows high, stable field emission without any further processing steps and turn-on fields as low as 1.3 V//spl mu/m.
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机译：通过使用飞秒激光辅助蚀刻对硅晶片的表面进行结构化处理，获得了尖锐的圆锥形微结构阵列。对阵列的分析显示出高而稳定的场发射，无需任何进一步的处理步骤，并且导通场低至1.3 V // spl mu / m。
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