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Timing Driven Layer Assignment Considering Via Resistance and Coupling Capacitance

机译:考虑电阻和耦合电容的时序驱动层分配

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As fabrication technology keeps advancing, many nano effects have become increasingly evident. With the steady increase in the number of metallization levels and the shrinking size of vias, via resistance has increased and affected the wire delay greatly. Furthermore, the wire delay is affected more by coupling capacitance instead of wire self capacitance. These problems must be considered in modern VLSI physical design. Traditional approaches only controlled the amount of vias and coupling, and did not optimize wire delay caused by via resistance and coupling capacitance directly. In this paper, we propose a timing driven layer assignment considering via-induced-delay and coupling-induced-delay simultaneously. First, path based timing analysis is used to find the timing-critical part of a circuit. Second, a via aware timing model is suggested to calculate wire delay. Third, the procedure of layer assignment is guided by a Guiding Factor which decides how to assign a net on an appropriate layer pair for direct delay optimization. Experimental results on benchmark circuits show that timing driven layer assignment is necessary and the proposed greedy algorithm is promising.
机译:随着制造技术不断推进,许多纳米效应变得越来越明显。通过稳定增加金属化水平的数量和通孔的缩小尺寸,通过电阻增加并影响了电线延迟。此外,通过耦合电容而不是电线自电容,电线延迟更加受影响。必须在现代VLSI物理设计中考虑这些问题。传统方法仅控制通孔和耦合量,并且没有直接通过电阻和耦合电容引起的导线延迟。在本文中,我们提出了一种同时考虑通过诱导延迟和耦合诱导延迟的定时驱动层分配。首先,基于路径的定时分析用于找到电路的时序关键部分。其次,建议通过AVERIPAIT定时模型计算导线延迟。第三,层分配的过程由指导因子引导,该指导因子决定如何在适当的层对上分配用于直接延迟优化的网络。基准电路上的实验结果表明,需要定时驱动层分配,并且所提出的贪婪算法很有前景。

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