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Assessment of a Haptic Virtual Assembly System that uses Physics-based Interactions

机译:评估使用基于物理的交互的触觉虚拟装配系统

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Assembly is one of the most extensively studied manual processes in manufacturing. Using design for assembly (DFA) methodologies relative times of real-world assembly tasks such as manipulation and insertion can be quantified. However, it is unclear if similar values can be reflected in a virtual assembly system? This question forms the rationale for the peg-in-hole assembly task addressed in this study. Although almost simplistic in nature, assembling a peg into a hole addresses three fundamental states in an assembly process - picking, placing and motion within an environment. The objective here is to investigate assembly performance in the virtual environment using a force feedback haptic device benchmarked against previously quantified data. Inclusive, is a kinematic evaluation of task performance for peg-in-hole manipulation based on geometric and force conditions.
机译:组装是制造中研究最广泛的手动过程之一。使用装配设计(DFA)方法,可以量化实际装配任务(例如操纵和插入)的相对时间。但是,不清楚在虚拟装配系统中是否可以反映相似的值?这个问题构成了本研究中解决的孔内钉装配任务的基本原理。尽管本质上几乎是简单的,但将销钉组装到孔中可解决组装过程中的三个基本状态-在环境中拾取,放置和移动。此处的目的是使用针对先前量化数据进行基准测试的力反馈触觉设备来研究虚拟环境中的装配性能。包括在内,是根据几何条件和受力条件对钉入式孔进行任务性能的运动学评估。

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