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Substrate loss of on-chip transmission-lines with power/ground wires in lower layer

机译:电源/地线在下层的片上传输线的基板损耗

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This paper discusses shielding effect of power/ground wires in lower layer. A conducting substrate affects characteristics of on-chip transmission line. However in many cases on actual chips, there are P/G wires between the signal wire and the substrate that may shield the substrate coupling. We show measurement and simulation results of on-chip transmission-lines with narrow yet many power/ground wires in a lower layer. Experimental results show that narrow power/ground wires in a lower layer in parallel to the signal wire, which are common in LSI power distribution network, shield substrate coupling and suppress substrate loss. On the other hand, orthogonal power/ground wires in a lower layer hardly mitigate substrate coupling.
机译:本文讨论了下层电源/地线的屏蔽效果。导电基板会影响片上传输线的特性。但是,在实际芯片上的许多情况下,信号线和基板之间存在P / G线,可能会屏蔽基板耦合。我们在下层显示了具有狭窄但许多电源/接地线的片上传输线的测量和仿真结果。实验结果表明,与信号线平行的下层较窄的电源/接地线在LSI配电网络中很常见,可屏蔽基板耦合并抑制基板损耗。另一方面,下层中的正交电源线/地线几乎不会减轻基板耦合。

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