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Design methodology innovations address manufacturing technology challenges: power and performance

机译:设计方法论创新解决了制造技术挑战:功率和性能

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Semiconductor design has benefited tremendously from process technology scaling in the past, especially for power consumption and performance. This era is coming to an end. Continued improvement in these key metrics requires even more innovation in design methodology and design automation than in the past. Power consumption increasingly is becoming the most important bottleneck in the design of ICs in advanced process technologies. An evaluation of the use ultra-low threshold voltage (V/sub th/) devices for power reduction in an advanced process technology is described. It turns out that in contrast to older process technologies, this approach increasingly is becoming less suitable for industrial usage in advanced process technologies. Thus, design methodologies are described which can reduce power consumption by optimizations in logic design, specifically by utilizing multiple levels of supply voltage V/sub dd/ and threshold voltage V/sub th/. The next major challenge on the horizon is increasing variability, both in the manufacturing process and in operating conditions. The need for statistical approaches to counter rising variability is described.
机译:过去,半导体设计已从制程技术的扩展中受益匪浅,特别是在功耗和性能方面。这个时代即将结束。与过去相比,这些关键指标的持续改进要求在设计方法和设计自动化方面进行更多的创新。功耗越来越成为高级工艺技术中IC设计的最重要瓶颈。描述了在先进工艺技术中使用超低阈值电压(V / sub th /)器件进行功率降低的评估。事实证明,与较旧的处理技术相比,此方法越来越不适用于高级处理技术中的工业用途。因此,描述了可以通过逻辑设计的优化,特别是通过利用多个电平的电源电压V / sub dd /和阈值电压V / sub th /来降低功耗的设计方法。即将出现的下一个主要挑战是在制造过程和操作条件下不断增加的可变性。描述了需要采用统计方法来应对不断变化的变化。

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