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Improved characteristics of reactive-ion-etching damage for n-GaN epitaxial layers after post-etch treatments

机译:蚀刻后处理后n-GaN外延层的反应离子蚀刻损伤的改善特性

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Reactive ion etched (RIE) surfaces of n-type GaN epitaxial films were investigated It is found that the recovery of crystal damage in optical properties can be achieved up to 60-65% of the photoluminescence (PL) peaks before RIE processing, for the samples thermally annealed at 750 /spl deg/ C for 3 minutes. By using transmission-line model, it is evident that KOH surface treatment prior to contact deposition is more effective in lowering contact resistance than that of the damaged surface only restored by RTA processing.
机译:研究了n型GaN外延膜的反应离子刻蚀(RIE)表面,发现对于RIE,在RIE处理之前,可以恢复高达60-65%的光致发光(PL)峰值的晶体损伤。样品在750 / spl℃/的温度下热退火3分钟。通过使用传输线模型,很明显在接触沉积之前进行KOH表面处理在降低接触电阻方面比仅通过RTA加工恢复的受损表面更有效。

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