Array sockets and connectors using MicroSpring/sup TM/ technology

摘要

In the electronics industry, there are a number of market factors driving the development of separable high density array connections for socketing components and interconnecting printed circuit boards. Many of the existing socket and connector technologies do not ideally address these needs. Finer pitch, lower height, improved electrical performance, lower mating force, higher durability, and industry standard manufacturing processes are required, to name a few. In addition, quick to market, economical prototyping and competitive production costs are necessary. To meet this diverse set of requirements, a revolutionary, bondwire scale contact technology has been developed and applied to several types of interconnection products. This technology, as well as its associated fabrication process is easily customized for each application and is capable of contact pitches down to 0.5 mm (0.019 in) at 10 to 15 g of normal (mating) force. This paper describes the process used to create reliable contact structures, including examples of process variables that can be altered to meet application specific mechanical and electrical performance requirements. The results of electrical and mechanical modeling of several contact geometries are presented and discussed, as well as reliability test results and contact interface mechanics analysis. A concluding section is devoted to a discussion of the practical application of this technology to interconnection products with examples of current applications and products in development.