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Three Dimensional Smart Pixel Integration Of A GaAs-based Detector Array Directly On Top Of Silicon Circuits

机译：直接在硅电路顶部的基于GaAs的检测器阵列的三维智能像素集成

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《》|1994年|P.2-56-2-58|共1页
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Camperi-Ginestet; C.; Buchanan; B.;
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中图分类无线电电子学、电信技术;
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1. Parallel optical coherence tomography in scattering samples using a two-dimensional smart-pixel detector array [J] . Ducros M., Laubscher M., Karamata B., Optics Communications: A Journal Devoted to the Rapid Publication of Short Contributions in the Field of Optics and Interaction of Light with Matter . 2002,第1a3期

机译：使用二维智能像素检测器阵列的散射样品中的平行光学相干断层扫描
2. Optical coherence topography based on a two-dimensional smart detector array [J] . Bourquin S., Salathe RP., Seitz P. Optics Letters . 2001,第8期

机译：基于二维智能检测器阵列的光学相干断层扫描
3. A new method for directly locating single-event latchups using silicon pixel sensors in a gas detector [J] . Zili Li, Yan Fan, Zhen Wang, Nuclear Instruments & Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment . 2020,第May11期

机译：在气体探测器中使用硅像素传感器直接定位单事件闩锁的新方法
4. Three Dimensional Smart Pixel Integration Of A GaAs-based Detector Array Directly On Top Of Silicon Circuits [C] . Camperi-Ginestet C., Buchanan B., Institute of Electric and Electronic Engineer Topical meeting digest on integrated optoelectronics . 1994

机译：直接在硅电路顶部的基于GaAs的探测器阵列的三维智能像素集成
5. Development of a microsecond framing two-dimensional pixel array detector for time-resolved x-ray diffraction [D] . Barna, Sandor Lee 1997

机译：用于时间分辨X射线衍射的微秒帧二维像素阵列检测器的开发
6. Performance of In-Pixel Circuits for Photon Counting Arrays (PCAs) Based on Polycrystalline Silicon TFTs [O] . Albert K. Liang, Martin Koniczek, Larry E. Antonuk, -1

机译：基于多晶硅TFT的光子计数阵列（PCA）像素内电路的性能
7. 4 Three-Dimensional Silicon Smart Tactile Imager Using Large Deformation of Swollen Diaphragm with Integrated Piezoresistor Pixel Circuits [O] . Hidekuni Takao, Makoto Ishida 2015

机译：4采用集成压敏电阻像素电路的膨胀隔膜大变形的三维硅智能触觉成像仪
8. Infrared Imaging Array Integrated in Three Dimensions Directly on Top of Silicon Circuits. [R] . Brooke, M., Jokerst, N., Allen, M., 1993

机译：直接在硅电路顶部集成三维的红外成像阵列。

Three Dimensional Smart Pixel Integration Of A GaAs-based Detector Array Directly On Top Of Silicon Circuits

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