Dimensional analysis is used to develop a macromodel for point-to-point multichip module (MCM) interconnect delay, which applies to lossless and lossy lines. The equation for lossless lines is linear and very simple; the equation for lossy lines is quadratic. In terms of computational costs, the evaluation of delay involves 24 multiplications, and is several orders of magnitude faster than using circuit simulation or transmission line analysis programs to calculate delays. Using the macromodel, the authors derived the dependence of delay on several technology parameters, and calculated the sensitivity of delay to the circuit parameters.
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