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Qualification of Hot Isostatic Pressing Processes

机译:热等静压工艺的鉴定

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摘要

Hot isostatic pressing (HIP) is a process in which material is subjected to controlled temperature and isostatic gas pressure, such as argon gas. The theory behind this process is to create a hydrostatic pressure in the vessel high enough so that any internal porosity (not surface connected) will collapse. While the effectiveness of the HIP process may be evaluated with actual product, the population may not contain "worst-case" defects. It is therefore of greater interest to use a test sample designed to simulate a worst-case scenario with an exaggerated internal void. The test sample is made of the alloy of interest, for example cast cobalt-28chromium-6molybdenum with a counter-bored hole in the center, and a wrought cobalt-28chromium-6molybdenum cylindrical pin that is vacuum welded after press fit into the hole. A cavity is created within the counter-bore between the bottom of the pin and the surrounding base. This cavity size is designed to be approximately 5 or 10 times larger than the smallest detectable void (based on radiography sensitivity of 2-2T) such that the test sample represents an exaggerated worst-case internal void. An appropriate sample size of the test samples are then subjected to extreme and nominal HIP processing conditions, distributed throughout the HIP vessel. Subsequent solution annealing or other standard thermal processing may be performed. Test samples are evaluated for closure of the internal void by radiography, and residual porosity analysis may be performed by metallographic examination.
机译:热等静压(HIP)是一种过程,在这种过程中,材料要承受受控的温度和等静压,例如氩气。该过程背后的理论是在容器中产生足够高的静水压力,以使任何内部孔隙(未连接表面)都将崩溃。虽然可以使用实际产品评估HIP过程的有效性,但总体上可能不包含“最坏情况”的缺陷。因此,使用设计用于模拟内部空隙过大的最坏情况的测试样品将引起更大的兴趣。测试样品由感兴趣的合金制成,例如在中心带有沉头孔的铸造钴28铬6钼和锻压的钴28铬6钼圆柱销,在压入该孔后进行真空焊接。在销的底部和周围的底部之间的沉孔内会形成一个空腔。该空腔的尺寸设计为比最小可检测空隙(基于2-2T的射线照相灵敏度)大5或10倍,以使测试样品代表夸大的最坏情况内部空隙。然后将适当大小的测试样品置于极端和名义HIP处理条件下,分布在整个HIP容器中。随后可以进行固溶退火或其他标准热处理。通过射线照相法评估测试样品对内部空隙的封闭,并且可以通过金相检查进行残留孔隙率分析。

著录项

  • 来源
    《Medical device materials VI》|2011年|69-73|共5页
  • 会议地点 Minneapolis MN(US)
  • 作者单位

    DePuy Orthopaedics, Inc., Warsaw, Indiana, USA;

    DePuy Orthopaedics, Inc., Warsaw, Indiana, USA;

    DePuy Orthopaedics, Inc., Warsaw, Indiana, USA;

    DePuy Orthopaedics, Inc., Warsaw, Indiana, USA;

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  • 原文格式 PDF
  • 正文语种 eng
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