ADVANCEMENTS IN ACOUSTIC MICRO IMAGING FOR THE NON-DESTRUCTIVE INSPECTION OF CERAMIC COMPONENTS AND DEVICES

摘要

Ceramic materials, components and devices often include bulk and multi-laminate structures with several bond or seal interfaces of critical importance. These interfaces often include critical mechanical, thermal and electrical junctures. What is common to all is the construction of one or more layers that must be sealed or bonded with a specific degree of integrity. A failure in the material or in the seal or bond area could mean possible failure in its functionality and/or operation. Acoustic Micro Imaging (AMI) is a nondestructive inspection technique that utilizes high frequency ultrasound to detect a wide variety of defects or failures within ceramic components, devices and related materials, typically at an interface between two materials. It can be applied to a variety of components and devices such as micro-chips, housings, substrates, micro-arrays and sensors as well as a variety of larger modules. With source frequencies ranging from 5 to 300 MHz the technology has the capability to image features as small as 5 microns in size. There are a wide variety of materials that are applicable to AMI including adhesives, solders, paste, polymers, metals, ceramics and composites. This paper will review the basic principles underlying the inspection technology and exemplify where new advancements can be applied within ceramic materials, devices and components.