Brno University of Technology, Faculty of Electrical Engineering and Communication, Department of Microelectronics, Udolni 53, 602 00 Brno, Czech Republic;
Brno University of Technology, Faculty of Electrical Engineering and Communication, Department of Microelectronics, Udolni 53, 602 00 Brno, Czech Republic;
Brno University of Technology, Faculty of Electrical Engineering and Communication, Department of Microelectronics, Udolni 53, 602 00 Brno, Czech Republic;
Brno University of Technology, Faculty of Electrical Engineering and Communication, Department of Microelectronics, Udolni 53, 602 00 Brno, Czech Republic;
Brno University of Technology, Faculty of Electrical Engineering and Communication, Department of Microelectronics, Udolni 53, 602 00 Brno, Czech Republic;
3D Packaging; ANSYS; Lead-free; Reliability; Solder joint;
机译:SAC305无铅焊料在不同表面处理中的IMC生长机理及其对FCBGA封装焊点可靠性的影响
机译:在各种锡铅焊接工艺条件下组装的无铅区域阵列封装的焊点特性和可靠性
机译:封装级封装(PoP)技术中组装参数对无铅焊点可靠性的影响
机译:3D包装结构中无铅焊点行为的可靠性和仿真
机译:电子包装组件中锡基无铅焊点的晶粒结构演变及其对疲劳可靠性的影响。
机译:电子设备中无铅焊点的可靠性问题
机译:BGA封装中无铅焊料互连可靠性评估的数值模拟