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Chemical Fracture of a Ceramic Oxygen Ion Conductor with Periodic Edge Cracks

机译:具有周期性边缘裂纹的陶瓷氧离子导体的化学断裂

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This paper investigates multiple surface cracking in an oxygen ion conducting ceramic undergoing lattice expansion. We assume that the cracks are parallel and periodically distributed, which allows detailed examination of the effects of multiple crack interactions as well as analytical treatment of the problem. A singular integral equation method is used to calculate the chemical stress intensity factor (CSIF) at the crack tips in the framework of linear chemo-elastic fracture mechanics. The effect of crack spacing or crack density on the CSIF is examined using the numerical results for the periodic cracks at the cathode side of an oxygen ion conducting ceramic under the constrained flat conditions. It is found that the CSIF can be reduced dramatically by decreasing the crack spacing (or increasing the crack density). Hence, the fracture resistance of ceramic oxygen ion conductors can be enhanced with high density multiple surface cracks.
机译:本文研究了发生晶格膨胀的氧离子传导陶瓷的多表面裂纹。我们假设裂纹是平行且周期性分布的,这允许详细检查多个裂纹相互作用的影响以及对该问题的分析处理。在线性化学弹性断裂力学的框架下,使用奇异积分方程法计算裂纹尖端的化学应力强度因子(CSIF)。裂纹间距或裂纹密度对CSIF的影响使用在受限平面条件下氧离子传导陶瓷阴极侧周期性裂纹的数值结果进行了检验。发现通过减小裂纹间距(或增加裂纹密度)可以显着降低CSIF。因此,可以通过高密度的多个表面裂纹来增强陶瓷氧离子导体的耐断裂性。

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