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Fabrication of MEMS devices by powder-filling into DXRL-formed molds

机译:通过粉末填充到DXRL形成的模具中来制造MEMS器件

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We have developed a variety of processes for fabricating components for micro devices based on deep x-ray lithography (DXRL). Although the techniques are applicable to many materials, we have demonstrated them using hard (Nd_2Fe_(14)B) and soft (Ni-Zn ferrite) magnetic materials because of the importance of these materials in magnetic micro-actuators and other devices and because of the difficulty fabricating them by other means. The simplest technique involves pressing a mixture of magnetic powder and a binder into a DXRL-formed mold. In the second technique, powder is pressed into the mold and then sintered to densify. The other two processes involve pressing at high temperature either powder or a dense bulk material into a ceramic mold that was previously made using a DXRL mold. Theses techniques allow arbitrary 2-dimensional shapes to be made 10 to 1000 #mu# m thick with in-plane dimensions as small as 50 #mu# m and dimensional tolerances in the micron range. Bonded istropic Nd_2Fe_(14) micro-magnets made by these processes had an energy product of 7 MGOe.
机译:我们已经开发出多种基于深X射线光刻(DXRL)的微型设备组件制造工艺。尽管该技术适用于多种材料,但由于这些材料在磁性微致动器和其他设备中的重要性,并且已经证明了它们使用硬(Nd_2Fe_(14)B)和软(Ni-Zn铁氧体)磁性材料的情况。用其他方法制造它们的困难。最简单的技术涉及将磁性粉末和粘合剂的混合物压入DXRL成型模具中。在第二种技术中,将粉末压入模具中,然后烧结以致密化。其他两个过程涉及在高温下将粉末或致密块状材料压入先前使用DXRL模具制成的陶瓷模具中。这些技术允许将任意二维形状制成10至1000#μm的厚度,且平面内尺寸小至50#μm,并且尺寸公差在微米范围内。通过这些过程制得的粘结的各向同性Nd_2Fe_(14)微磁体的能量积为7 MGOe。

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