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Cu to Cu bonding with Cu@Ag core-shell nanoparticles

机译:Cu @ Ag核壳纳米粒子与Cu到Cu的键合

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In this study, PVP-protected Cu@Ag core-shell nanoparticles with different Ag shell thicknesses were synthesized and applied to Cu to Cu bonding. The phase transformation of Cu@Ag core-shell nanoparticles (about 80 nm in average particle diameter and 10 nm in shell thickness) upon heating in air was investigated via in situ synchrotron radiation X-ray diffraction. The formation temperatures of copper oxides (CuO and Cu2O) were higher than those of pure Cu nanoparticles. This verifies that the oxidation of Cu nanoparticles can be effectively retarded by the Ag shell. It is also demonstrated that firm bonding between two Cu pads could be obtained using Cu-Ag particle pastes after thermal compression at 250 °C.
机译:在这项研究中,合成了具有不同Ag壳厚度的PVP保护的Cu @ Ag核壳纳米粒子,并将其应用于Cu与Cu的键合。通过原位同步辐射X射线衍射研究了在空气中加热时Cu @ Ag核壳纳米粒子(平均粒径约80 nm,壳厚度约10 nm)的相变。铜氧化物(CuO和Cu2O)的形成温度高于纯铜纳米颗粒的形成温度。这证明了Ag壳可以有效地阻止Cu纳米颗粒的氧化。还证明了在250°C的热压下后,使用Cu-Ag颗粒糊剂可以在两个Cu焊盘之间获得牢固的结合。

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