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Manufacturing Method for Core-Shell Metal Nanoparticle Structure Having Excellent Oxidation Stability Using Cu@Ag Core-Shell Nanoparticles

机译:Cu @ Ag核壳纳米粒子制备具有优异氧化稳定性的核壳金属纳米粒子结构的方法

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As the development of manufacturing technology for electronic devices, propresses it is necessary to study manufacturing technologies for mass storage, low-volume, improved reliability, and low cost materials for electronic devices used in data communication. The noble metals are the most commonly used raw materials used in such manufacturing. However, the raw materials (Ag, Pt, etc.) are expensive and raise the manufacturing cost. So, there is a need to replace these materials with raw materials of low cost. Recently, the much-cheaper Cu has received attention in that it has the same properties as the noble metals. Cu has good physical and chemical properties. However, its anti-oxidation is weak. Therefore, to make up for this weak point, research has generally been conducted to find a method to coat copper with a noble metal. The coating, comprised of the noble metal, is strong against the oxidation of the Cu surface. In this study, we made Cu@Ag core shell nanoparticles; these particles have the same level of electro-conductivity as Ag. These materials are expected to reduce the product cost of raw materials.
机译:随着电子设备制造技术的发展,迫切需要研究用于数据通信的电子设备的大容量存储,小容量,提高的可靠性和低成本材料的制造技术。贵金属是这种制造中最常用的原材料。但是,原材料(Ag,Pt等)价格昂贵并且增加了制造成本。因此,需要用低成本的原材料代替这些材料。近来,便宜得多的铜由于与贵金属具有相同的性质而受到关注。铜具有良好的物理和化学性质。但是,其抗氧化作用较弱。因此,为了弥补这一弱点,通常已经进行了研究以找到一种用贵金属涂覆铜的方法。由贵金属组成的涂层对铜表面的氧化具有很强的抵抗力。在这项研究中,我们制备了Cu @ Ag核壳纳米粒子。这些粒子的导电性与Ag相同。这些材料有望降低原材料的生产成本。

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