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Erosion-corrosion of copper in cooling water systems at 60℃ using animpinging liquid jet and Electrochemical Quartz Crystal Microbalance

机译:冲击液体射流和电化学石英晶体微量天平在60℃冷却水系统中对铜的腐蚀腐蚀

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摘要

When water flows over copper, turbulence may be created at different parts of metal surfacern(such as bends, tees, sudden changes in section), and may be sufficient to cause breakdown ofrnthe surface layer, even with a solution that is free from suspended solids.rnAn impinging liquid jet directed at normal incidence onto a copper sample was used in thisrnwork. It was generated using a recirculating solution of 10-3M Na2SO4, continuouslyrndeaerated and heated at 60℃. Two types of copper samples were investigated: a bulk copperrnelectrode was first anodised to form a copper oxide layer, before submitting it to thernimpinging jet. The polarisation resistance was then measured as a function of the time ofrnimpinging. In an other test, an electrolytic copper layer was deposited on an EQCM, thenrnpolarisation resistance and mass change were followed as a function of the time of impinging.rnThe results are discussed from electrochemical and mass change measurements, and fromrnscanning electronic microscopic observations. Comparisons are made with the variation of thernpolarisation resistance measured as a function of time, in the same solution, using a rotatingrndisk electrode, at which no turbulence is assumed to occur.
机译:当水流过铜时,可能会在金属表面的不同部分产生湍流(例如,弯曲,三通,截面突然变化),即使使用不含悬浮固体的溶液,也足以引起表面层的破裂。在此工作中,使用了以垂直入射方向入射到铜样品上的撞击液体射流。它是使用10-3M Na2SO4循环溶液生成的,经过连续脱气并在60℃加热。对两种类型的铜样品进行了研究:首先对块状铜电极进行阳极氧化以形成氧化铜层,然后再将其送入冲击射流。然后根据极化时间测量极化电阻。在另一项测试中,在EQCM上沉积了一层电解铜层,然后跟踪了极化强度和质量随撞击时间的变化。结果将通过电化学和质量变化测量以及扫描电子显微镜观察结果进行讨论。在相同的解决方案中,使用旋转圆盘电极,将测得的极化电阻随时间的变化进行比较,假设旋转时不会发生湍流。

著录项

  • 来源
  • 会议地点 Nice(FR)
  • 作者

    E. Sutter; T.T.M. Tran; C. Fiaud;

  • 作者单位

    Laboratoire de Génie des Procédés Plasmas et Traitements de Surface, UPMC/ENSCPrnUPRES 287, 11 rue P. et M. Curie, F-75231 PARIS Cedex 05.rnTél: 33 1 44 27 67 20 Fax: 33 1 43 26 37 38rne-mail: eliane-sutter@enscp.jussieu.fr;

    Laboratoire de Génie des Procédés Plasmas et Traitements de Surface, UPMC/ENSCPrnUPRES 287, 11 rue P. et M. Curie, F-75231 PARIS Cedex 05;

    Laboratoire de Génie des Procédés Plasmas et Traitements de Surface, UPMC/ENSCPrnUPRES 287, 11 rue P. et M. Curie, F-75231 PARIS Cedex 05;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    EQCM; Impinging liquid jet; RDE; copper;

    机译:EQCM;撞击液体射流; RDE;铜;

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