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首页> 外文会议>Light-emitting diodes: Materials, devices, and applications for solid state lighting XXI >Validation of Thermal Effects of LED Package by Using Elmer Finite Element Simulation Method
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Validation of Thermal Effects of LED Package by Using Elmer Finite Element Simulation Method

机译：Elmer有限元模拟方法验证LED封装的热效应

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摘要

The overall performance of the Light-emitting diode, LED package is critically affected by the heat attribution. In this study, open source software -Elmer FEM has been utilized to study the thermal analysis of the LED package. In order to perform a complete simulation study, both Salome software and Para View software were introduced as Pre and Postprocessor. The thermal effect of the LED package was evaluated by this software. The result has been validated with commercially licensed software based on previous work. The percentage difference from both simulation results is less than 5% which is tolerable and comparable.
机译：发光二极管，LED封装的整体性能受热量属性的严重影响。在这项研究中，开源软件-Elmer FEM已被用于研究LED封装的热分析。为了进行完整的仿真研究，同时引入了Salome软件和Para View软件作为Preprocessor和Postprocessor。通过此软件评估了LED封装的热效应。该结果已使用基于先前工作的商业许可软件进行了验证。来自两个模拟结果的百分比差异小于5％，这是可以忍受的并且是可比较的。

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  • 来源
  • 会议地点 San Francisco(US)
  • 作者

    Lai Siang Leng; Vithyacharan Retnasamy; Mukhzeer Mohamad Shahimin; Zaliman Sauli; Steven Taniselass; Muhamad Hafiz Bin Ab Aziz; Rajendaran Vairavan; Supap Kirtsaeng;

  • 作者单位

    School of Microelectronic Engineering, University Malaysia Perlis (UniMAP), Kampus Alam, Pauh Putra, 02600 Arau, Perlis, Malaysia;

    School of Microelectronic Engineering, University Malaysia Perlis (UniMAP), Kampus Alam, Pauh Putra, 02600 Arau, Perlis, Malaysia;

    Department of Electrical and Electronic Engineering, Faculty of Engineering, National Defence University of Malaysia (UPNM),Kem Sungai Besi, 57000 Kuala Lumpur, Malaysia;

    School of Microelectronic Engineering, University Malaysia Perlis (UniMAP), Kampus Alam, Pauh Putra, 02600 Arau, Perlis, Malaysia;

    School of Microelectronic Engineering, University Malaysia Perlis (UniMAP), Kampus Alam, Pauh Putra, 02600 Arau, Perlis, Malaysia;

    Faculty of Engineering Technology,Universiti Malaysia Perlis (UniMAP),Kampus UniCITI Alam,Sungai Chuchuh, Padang Besar,02100 Perlis, Malaysia;

    School of Microelectronic Engineering, University Malaysia Perlis (UniMAP), Kampus Alam, Pauh Putra, 02600 Arau, Perlis, Malaysia;

    Faculty of Science, Silpakorn University, Mueang, Nakhon Pathom, 73000, Thailand;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    LED package; thermal effect; Elmer FEM; Salome; ParaView;

    机译：LED封装热效应Elmer FEM；莎乐美ParaView;

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