High-speed 3D shape measurement using a nonscanning multiple-beam confocal imaging system

摘要

Abstract: This paper describes a high-speed 3D shape measurement system for in-line semiconductor package inspections. The system consists of three parts. One is an optics and sensor for confocal imaging, which we call a non-scanning multiple- beam confocal microscope. The microscope can get a confocal image within very short time because XY-scanning, which is required in conventional confocal microscopes, is not needed. Another is the algorithm that performs reconstructing the object surfaces accurately from a few confocal images. The last is a mechanism that performs shifting the focused plane of the microscope very quickly. This experimental system can measure objects having a space of 9.6 $MUL 9.6 $MUL 0.64 mm in less than 0.4 s with an accuracy in the order of 1 $mu@m. !9