Selective Laser Soldering and Assembly Of Optoelectronic Circuits

摘要

Because of the fragility of optical packages and their glass "pigtails", hand assembly will dominate the placement of optical packages on boards for the foreseeable future. Even if we resolve the "pigtail paradigm", the internal seals and joining technologies for the current and near-term generation of hermetic packages dictates that they will not withstand reflow. Hand soldering is slow and unreliable and can be replaced by other techniques. This paper reviews promising attachment technologies including z-axis attachment, sockets and adhesives and discusses in detail the pros and cons of direct laser soldering of optical packages.