Effect of Various Cleaning Solutions and Brush Scrubber Kinematics on the Frictional Attributes of Post Copper CMP Cleaning Process

摘要

A systematic study using shear force measurement to understand the effect of cleaning solutions and brush scrubber kinematics in post copper CMP cleaning has been explored. Higher shear force is observed when the surfactant containing cleaning solution interacts with copper surface that has been exposed to CMP slurry. This work underscores the necessity of implementing high brush rotation rates for post copper CMP cleaning processes.