Q-TAT Production and CIM Systems for the Packaging Process within IC Fabrication

摘要

In an effort to achieve small-lot production of multiple product variations and reduced delivery time. Sharp has been committed to improving the wafer process of IC production. For the packaging process, however, our efforts were limited to improving production equipment. Effort for small-lot production of multiple product variations through the entire line and for Q-TAT line was insufficient, for the following reasons:rn(1) Process materials include wafers, lead frames, and packages, whose outlines vary greatly. As a result, the jigs that transfer products from one process to the next include magazines, sleeves, and trays whose shapes and capacities also vary considerably. Tins proved an obstacle to efficient lot management and the automation of inter-process transfers.rn(2) The post-molding solder plating process for the outer leads was a problem area. This was an obstacle to reducing TAT.