CUTTING AND HANDLER SYSTEM FOR INCREASING WORK EFFICIENCY IN SEMICONDUCTOR PACKAGE FABRICATION PROCESS BY SEQUENTIALLY ARRANGING COMPONENTS IN STRIP/PACKAGE PROCESSING ORDER

摘要

PURPOSE: A cutting and handler system for semiconductor package fabrication is provided to simplify a processing flow and improve productivity by sequentially arranging components of the cutting and handler system in a strip/package processing order. CONSTITUTION: A plurality of semiconductor strips are loaded on an on-load unit(100). A cutting unit(200) cuts the semiconductor strips into individual semiconductor packages. A cleaning unit(300) cleans the semiconductor packages. A semiconductor strip picker(140) is moved between the on-load unit and the cutting unit in order to transfer the semiconductor strips from the on-load unit to the cutting unit. A package picker(240,520) is installed between the cutting unit and the cleaning unit in order to transfer the individual semiconductor packages to the cleaning unit.