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Handler system and semiconductor package manufacturing process for cutting
Handler system and semiconductor package manufacturing process for cutting
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机译:用于切割的处理器系统和半导体封装制造工艺
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摘要
Semiconductor package manufacturing process for cutting system is disclosed. This cutting system, and on the loader device, a cutting device, and cleaning equipment are arranged sequentially, with the on-loader device, a cutting device and a cleaning device, the semiconductor strip, along the process direction of travel Since cut into individual semiconductor packages while transmitted sequentially, to improve the processing speed and the cutting of the semiconductor strips.
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