Interconnection technique of ALIVH~(~R) substrate

摘要

The unique interconnection using conductive paste of ALIVH~(~R) substrate, especially its structure, was studied. Calculation and SEM image suggested the existence of metallic bond between copper particles and between copper particle and copper foil. Assuming that metallic bond exist, interconnection resistance variation with temperature was able to be explained. We also studied considerable factors to obtain strong interconnection. As a consequence, compression and binder system of conductive paste play important roles in achieving strong interconnection.