Advanced Composites And Other Advanced Materials For Electronic Packaging Thermal Management

摘要

A variety of new advanced composites and other advanced materials are now available which provide great advantages over conventional materials for thermal management and microelectronic packaging, including: 1. extremely high thermal conductivities (over three times that of copper) 2. low, tailorable coefficients of thermal expansion 3. weight savings up to 80% 4. size reductions up to 65% 5. extremely high strength and stiffness 6. reduced thermal stresses 7. increased reliability 8. simplified thermal design 9. possible elimination of heat pipes 10. low cost, net shape fabrication processes 11. potential cost reductions.