首页> 外文会议>International Photovoltaic Science and Engineering Conference(PVSEC-15): Technical Digest vol.1; 20051010-15; Shanghai(CN) >Passivation of p+-Surfaces by PECVD Silicon Carbide Films - A Promising Method for Industrial Silicon Solar Cell Applications
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Passivation of p+-Surfaces by PECVD Silicon Carbide Films - A Promising Method for Industrial Silicon Solar Cell Applications

机译:PECVD碳化硅膜对p +表面的钝化-工业硅太阳能电池应用的一种有前途的方法

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摘要

We present first results of a surface passivation study of p~+-Si by amorphous SiC_x, deposited in a standard PECVD reactor. For comparison, thermally grown SiO_2 and PECVD-SiN_x layers with refractive indices of n=2.0 and n=2.4 were examined on the same test structures. While thermal SiO_2 exhibits passivating properties comparable to those on n~+-Si, PECVD-SiN_x is found to even deteriorate the surface passivation. On the other hand, PECVD-SiC_x yields, to our knowledge, the best p~+-Si pasivation so far obtained by an industrially relevant low temperature process.
机译:我们介绍了由非晶SiC_x在标准PECVD反应器中沉积的p〜+ -Si表面钝化研究的初步结果。为了比较,在相同的测试结构上检查了折射率为n = 2.0和n = 2.4的热生长SiO_2和PECVD-SiN_x层。尽管热SiO_2的钝化性能与n〜+ -Si相当,但发现PECVD-SiN_x甚至会使表面钝化变差。另一方面,据我们所知,PECVD-SiC_x产生了迄今为止通过工业相关的低温工艺获得的最佳的p〜+ -Si晶化。

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