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Run by Run (Generalized SPC) Control of Semiconductor Processes on the Production Floor

机译:在生产车间对半导体工艺进行逐次运行(通用SPC)控制

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Classical Statistical Process Control states that one should not make process adjustments after each run based on post process measurements. At the other end of the spectrum is real time control which makes process adjustments continuously as the process is running. Most semiconductor processes do not have sensors that allow for real time feedback control. Multiple linear response surface methodology coupled with run by run (Generalized SPC) control has been applied at Delco Electronics to a high volume production epitaxy deposition process.rnThis resulted in nearly a 1.8X improvement in process capability for thickness control. This was achieved by interfacing an IBM compatible 486 computer to Gemini II epi reactors, translating Sun workstation Matlab script code from the Massachusetts Institute of Technology into PC compatible Matlab script code, and combining this with the InTouch man machine interface (MMI) software package from Wonderware, Inc.rnThis paper is a case study of our experience at implementing this on the production floor. We discuss the general nature of the process to show why this methodology is relatively easy to apply. Operator training was simplified, data acquisition capability was added, new enhanced modes of operation were implemented, and enhanced capability for more advanced processes is possible on equipment the did not originally provide these features. We will conclude with observations about how future implementations can be simplified based on our experience.
机译:古典统计过程控制指出,不应在每次运行后根据过程后的测量结果进行过程调整。频谱的另一端是实时控制,它可以在过程运行时连续进行过程调整。大多数半导体工艺都没有允许实时反馈控制的传感器。 Delco Electronics已将多种线性响应表面方法与逐次运行(Generalized SPC)控制相结合,应用于大批量生产外延沉积工艺。这使厚度控制的工艺能力提高了近1.8倍。这是通过将IBM兼容的486计算机与Gemini II Epi反应器接口连接,将麻省理工学院的Sun工作站Matlab脚本代码转换为PC兼容的Matlab脚本代码并将其与InTouch人机界面(MMI)软件包相结合而实现的。 Wonderware,rn.rn本文是对我们在生产现场实施此经验的案例研究。我们讨论该过程的一般性质,以说明为什么这种方法相对容易应用。简化了操作员培训,增加了数据采集功能,实施了新的增强的操作模式,并且可能在最初没有提供这些功能的设备上增强了用于更高级过程的功能。我们将根据经验总结如何简化未来的实现。

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