Late-News Poster: Si-based LED Microdisplay: Design and Manufacturing Process

摘要

Design and manufacturing process of a cost-effective LED microdislay for the NTE applications fabricated using standard CMOS technology and containing an array of aluminum-nanostructured porous silicon reverse biased light emitting Schottky diodes will be presented. Being of a solid state construction, this microdisplay is thin and light in weight due to very simple device architecture. Its benefits include also super high resolution, wide viewing angles, fast response time and wide operating temperature range. The advantages of full integration of an LED-array and driving circuitry on a Si-chip will be also discussed.