Direct Fabrication of a-Si:H TFT Arrays on Flexible Substrates for High Information Content Flexible Displays: Challenges and Solutions

摘要

The principal challenges to direct fabrication of high performance a-Si:H transistor arrays on plastic and on flexible stainless steel substrates include automated handling through bonding-debonding processes, substrate-compatible low temperature TFT fabrication processes, and management of dimensional instability in the case of plastic substrates, and planarization and management of CTE mismatch in the case of stainless steel foils. The technology solutions developed at the Flexible Display Center to address these challenges are described.