首页> 外文会议>International conference on solid-state and integrated-circuit technology; 19951024-28; Beijing(CN) >Hydrogen Diffusion and Redistribution in PECVD Si-Rich Silicon Nitride during Rapid Thermal Annealing
【24h】

Hydrogen Diffusion and Redistribution in PECVD Si-Rich Silicon Nitride during Rapid Thermal Annealing

机译:快速热退火过程中PECVD富硅氮化硅中的氢扩散和再分布

获取原文
获取原文并翻译 | 示例

摘要

We have studied hydrogen release and movement in Si-rich PECVD nitride films as a result of a Rapid Thermal Anneal (RTA) process at varying temperatures. Combined with FTIR and Hydrogen Forward Spectrum, we studied the changes of hydrogen concentration and bonding configuration of the silicon nitride during RTA. We have found that during RTA some of NH bonds are converted to SiH bonds as well as hydrogen out diffusion from both SiH and NH bonds. Hydrogen diffusion coefficients of the silicon nitride are determined
机译:我们已经研究了在不同温度下由于快速热退火(RTA)过程而导致的富硅PECVD氮化物膜中氢的释放和运动。结合FTIR和氢正向光谱,研究了RTA过程中氢浓度和氮化硅键结构的变化。我们发现,在RTA期间,一些NH键被转化为SiH键,同时氢也从SiH和NH键中扩散出来。确定氮化硅的氢扩散系数

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号