首页> 外文会议>International Conference on Silicon Carbide and Related Materials 2001 Pt.2 Oct 28-Nov 2, 2001 Tsukuba, Japan >High-Power SiC Diodes: Characteristics, Reliability and Relation to Material Defects
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High-Power SiC Diodes: Characteristics, Reliability and Relation to Material Defects

机译:高功率SiC二极管:特性,可靠性以及与材料缺陷的关系

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Benchmarking power devices, Silicon Carbide diodes rate at about 2-3 decades lower in transient losses at the same static loss for voltages 300V - 20kV compared to Silicon. In this paper we present state-of-the-art results of unipolar Junction Barrier Schottky (JBS) diodes for the voltage range of 600-3300V and of bipolar PiN diodes for the range between 3kV and 6 kV. Switching of a power module with SiC diodes at 300Amp against 3000V_(dc) (3800V peak), is reported. Finally, the degradation of the forward properties of bipolar elements is related to the development of extended stacking faults in the epitaxial layer. These faults are found to originate at in-plane dislocations present in the virgin material.
机译:作为功​​率器件的基准,与300V到20kV的电压相比,在相同的静态损耗下,碳化硅二极管的瞬态损耗速率要低约2-3倍。在本文中,我们介绍了电压范围为600-3300V的单极结型势垒肖特基(JBS)二极管和电压范围为3kV至6 kV的双极性PiN二极管的最新技术成果。据报道,将功率为300Amp的SiC二极管的功率模块相对于3000V_(dc)(峰值为3800V)进行了切换。最后,双极元件正向性能的下降与外延层中扩展的堆叠断层的发展有关。发现这些断层起因于原始材料中存在的面内位错。

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