Scanning Acoustic Microscopy for Quality Assurance of MEMS Sensors

摘要

An overview of characteristic Scanning Acoustic Microscopy (SAM) inspection cases with focus on requirements and approaches used for Quality Assurance (QA) of MEMS sensors is given. The cases are divided into three sections. The feasibility of using high frequency, move of sound focus, and a developed A-scan simulation program to further enhance QA on MEMS sensors is discussed. New results on wafer to wafer silicon bonding and adhesive cure degree studies are presented.