首页> 外文会议>International Conference on Sensor 2003 vol.1; 20030513-15; Nuremberg(DE) >Scanning Acoustic Microscopy for Quality Assurance of MEMS Sensors
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Scanning Acoustic Microscopy for Quality Assurance of MEMS Sensors

机译:扫描声学显微镜以确保MEMS传感器的质量

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摘要

An overview of characteristic Scanning Acoustic Microscopy (SAM) inspection cases with focus on requirements and approaches used for Quality Assurance (QA) of MEMS sensors is given. The cases are divided into three sections. The feasibility of using high frequency, move of sound focus, and a developed A-scan simulation program to further enhance QA on MEMS sensors is discussed. New results on wafer to wafer silicon bonding and adhesive cure degree studies are presented.
机译:概述了特征扫描声学显微镜(SAM)检查案例,重点介绍了用于MEMS传感器质量保证(QA)的要求和方法。案件分为三个部分。讨论了使用高频,声焦点移动和开发的A扫描仿真程序进一步增强MEMS传感器质量保证的可行性。提出了晶片对晶片的硅键合和粘合剂固化度研究的新结果。

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